Title:
METHOD FOR MANUFACTURING ON-VEHICLE ELECTRONIC CONTROL DEVICE
Document Type and Number:
Japanese Patent JP2020116742
Kind Code:
A
Abstract:
To provide a method for manufacturing an on-vehicle electronic control device in which an occurrence of board warpage is suppressed.SOLUTION: A method for manufacturing an on-vehicle electronic control device according to the present invention is the method for manufacturing an on-vehicle electronic control device in which a wiring board 12 having a plurality of electronic components mounted on at least one surface is sealed with a molding material for sealing, and includes: an arrangement step of placing the wiring board to the inside of a molding space 102 of a mold 100 and fixing at least one of the one surface of the wiring board and the other surface opposite to the one surface by a pin 104; a filling step of injecting a molding material for sealing in a molten state from mold gates 106 and 108 to fill the molding space; and a sealing step of heating and pressurizing the molding material for sealing filled in the molding space to seal the wiring board by the molding material for sealing.SELECTED DRAWING: Figure 1
Inventors:
MOCHIZUKI SHUNSUKE
OKASAKA SHU
OKASAKA SHU
Application Number:
JP2019007114A
Publication Date:
August 06, 2020
Filing Date:
January 18, 2019
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
B29C33/14; B29C45/14; B29C45/27; H05K3/28
Domestic Patent References:
| JPH0825860A | 1996-01-30 | |||
| JPH0976282A | 1997-03-25 | |||
| JPH0760782A | 1995-03-07 | |||
| JP2002137248A | 2002-05-14 | |||
| JPH11254478A | 1999-09-21 | |||
| JP2004058442A | 2004-02-26 | |||
| JP2016007755A | 2016-01-18 |
Attorney, Agent or Firm:
Shinji Hayami