Title:
WIRING BOARD AND MANUFACTURING METHOD OF WIRING BOARD
Document Type and Number:
Japanese Patent JP2020120013
Kind Code:
A
Abstract:
SOLUTION: A wiring board has a first surface 21 and a second surface 22 located on the opposite side of the first surface, and includes a base material 20 having a first elastic coefficient, a wiring 52 located on the first surface side of the base material and connected to an electrode of an electronic component mounted on the wiring board, a protection member X located on the first surface side of the base material, and partially overlapped with at least the vicinity of the boundary between the end of the electronic component mounted on the wiring board and the wiring when viewed along the normal direction of the first surface of the base material, and having a second elastic modulus.EFFECT: It is possible to suppress disconnection of a wiring and improve durability of the wiring.SELECTED DRAWING: Figure 4
Inventors:
SAKATA MAKIKO
OGAWA KENICHI
OKIMOTO NAOKO
NAGAE MITSUTAKA
MIYOSHI TORU
OGAWA KENICHI
OKIMOTO NAOKO
NAGAE MITSUTAKA
MIYOSHI TORU
Application Number:
JP2019010391A
Publication Date:
August 06, 2020
Filing Date:
January 24, 2019
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
H05K1/02; H05K1/03
Domestic Patent References:
| JP2016509375A | 2016-03-24 |
Foreign References:
| US20140299362A1 | 2014-10-09 | |||
| US20120052268A1 | 2012-03-01 | |||
| US20140218872A1 | 2014-08-07 | |||
| US20170231089A1 | 2017-08-10 | |||
| KR20090092982A | 2009-09-02 |
Attorney, Agent or Firm:
Hiroyuki Nagai
Yukitaka Nakamura
Satoru Asakura
Yukihiro Hotta
Tomoya Deguchi
Yukitaka Nakamura
Satoru Asakura
Yukihiro Hotta
Tomoya Deguchi