Title:
PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2020154247
Kind Code:
A
Abstract:
To provide: a photosensitive resin composition having such characteristics that the photosensitive resin composition after cured can be exposed to light (with excellent photosensitivity in a deep portion) while preventing an exposure failure and that, when the composition is used as an insulation film for rewiring of a WLP, the composition shows a concealing property to a degree to prevent visual recognition of a wiring circuit pattern on a silicon wafer and the composition has an extremely little inner stress during shrinkage by curing; a dry film; a cured product; and an electronic component.SOLUTION: The photosensitive resin composition comprises (A) a polybenzoxazole precursor, (B) a photosensitive agent, and (C) an organic pigment, in which the compounding amount of the (C) organic pigment is 0.1 to 30 pts.mass when the compounding amount of the (A) polybenzoxazole precursor is set to 100 pts.mass.SELECTED DRAWING: None
Inventors:
IM YOUNGJUN
AKIMOTO MAHO
AKIMOTO MAHO
Application Number:
JP2019055237A
Publication Date:
September 24, 2020
Filing Date:
March 22, 2019
Export Citation:
Assignee:
TAIYO HOLDINGS CO LTD
International Classes:
G03F7/004; C08G73/22; G03F7/023
Domestic Patent References:
| JP2019023728A | 2019-02-14 |
Foreign References:
| WO2017057143A1 | 2017-04-06 | |||
| WO2015046332A1 | 2015-04-02 | |||
| WO2017217292A1 | 2017-12-21 | |||
| WO2018180548A1 | 2018-10-04 |
Attorney, Agent or Firm:
Ito On