Title:
CIRCUIT ARRAY
Document Type and Number:
Japanese Patent JP2020161530
Kind Code:
A
Abstract:
To provide a circuit array capable of integrating a structure that an insulation body is nipped between two conductors or a superconducting material with a large scale.SOLUTION: A circuit array includes a periodic structure part 1' structured so that a penetration hole 3 is periodically bored to a metal flat plate to a first direction as a radial direction of a primary maximum diameter d1 which is the maximum diameter of the penetration hole 3 in an interval shorter than the primary maximum diameter d1, and is periodically bored to a second direction as a radial direction of a secondary maximum diameter d2 that is the maximum diameter in a direction orthogonal to a direction of the primary maximum diameter d1 in an interval shorter than that of the secondary maximum diameter d2, and the periodic structure part 1' is formed by including: a bridge part 6 indicating property of an antiferromagnetic insulator; and island parts 7 and 7' formed as an island-shaped region, and indicating property of a conductor or a superconducting material.SELECTED DRAWING: Figure 1(e)
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Inventors:
ZEN NOBUYUKI
MAKISE YOSHIMASA
YAMAWAKI MASATO
MAKISE YOSHIMASA
YAMAWAKI MASATO
Application Number:
JP2019056437A
Publication Date:
October 01, 2020
Filing Date:
March 25, 2019
Export Citation:
Assignee:
AIST
International Classes:
H01L39/22; H01L29/66
Domestic Patent References:
| JP2008047852A | 2008-02-28 | |||
| JPH07162044A | 1995-06-23 |
Foreign References:
| WO2020003689A1 | 2020-01-02 | |||
| US20160093420A1 | 2016-03-31 |
Attorney, Agent or Firm:
Shin Shioda