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Title:
SUBSTRATE PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2020167413
Kind Code:
A
Abstract:
To provide a method of processing a substrate in an accurate and efficient manner.SOLUTION: A method for processing a substrate 2 that has a first surface 4 on which a division line 12 is formed and a second surface 6 opposite the first surface, includes the steps of: attaching a protective sheet 30 to the first surface; applying a laser beam (LB) to the protective sheet to form a plurality of alignment marks 16 in the protective sheet; and applying the LB to the substrate from the side of the first surface. The substrate is transparent to the LB, and the LB is applied to the substrate in a condition where a focal point of the LB is located at a position inside the substrate which is closer to the second surface than to the first surface, so as to form a plurality of alignment marks in a backside layer and/or in a region of the second surface in which the backside layer is not present. The method further includes a step of removing a substrate material from the side of the second surface along the division line using substrate material removing means 26. The alignment marks are used for aligning the substrate material removing means relative to the division line.SELECTED DRAWING: Figure 14

Inventors:
KARL HEINZ PRIEWASSER
TZANIMIR ARGUIROV
YUHIRA YASUKICHI
Application Number:
JP2020057175A
Publication Date:
October 08, 2020
Filing Date:
March 27, 2020
Export Citation:
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Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/301; B23K26/00; B23K26/364; B23K26/53; B23K26/57; H05K3/00
Domestic Patent References:
JP2015005610A2015-01-08
JP2009158648A2009-07-16
JP2015023094A2015-02-02
JP2019024038A2019-02-14
JP2011129606A2011-06-30
JP2011054841A2011-03-17
JP2016042526A2016-03-31
JP2010245172A2010-10-28
Attorney, Agent or Firm:
Yukitaka Nakamura
Satoru Asakura
Yukihiro Hotta
Enonami Kaoru