COOLING DEVICE

Japanese Patent JP2020173072

A

To provide a cooling device capable of preventing adhesion of liquid droplets of a primary refrigerant sealed in a container to a condensation pipe inside of the container even when the cooling device is miniaturized, and preventing dry-out of the primary refrigerant of a liquid phase.SOLUTION: In a heating device 1, a heating element is thermally connected to a region where a primary refrigerant of liquid phase exists or to the neighborhood of the region where the primary refrigerant of liquid phase exists, of an outer surface of a container 10, a container inner face surface area increase portion 50 for increasing a contact area with the primary refrigerant of liquid phase, is formed on an inner face of the container thermally connected to the heating element, at least a part of the container inner face surface area increase portion is dipped in the primary refrigerant of liquid phase, and a plate-like member 60 having a shielding portion 61 which is positioned at an upper part in a gravity direction of the container inner face surface area increase portion and a lower part in the gravity direction of a condensation pipe 40 and which is not at least partially dipped in the primary refrigerant of liquid phase, is disposed.SELECTED DRAWING: Figure 1

AOKI HIROSHI
INAGAKI YOSHIKATSU
KAWABATA KENYA
NAKAMURA YOSHINORI

JP2019075861A

October 22, 2020

April 11, 2019

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FURUKAWA ELECTRIC CO LTD

F28D15/02

JPH0632409B2	1994-04-27
JP2008522129A	2008-06-26
JP2014127539A	2014-07-07
JP2016054248A	2016-04-14

US20130105122A1

2013-05-02

Einzel Felix-Reinhard
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima
Shuichi Sumiyoshi

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