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Title:
FLOOR SOUND INSULATION STRUCTURE
Document Type and Number:
Japanese Patent JP2020190141
Kind Code:
A
Abstract:
To provide a floor sound insulation structure capable of easily adjusting a frequency of an object to be insulated and capable of being installed even when an underfloor space is narrowed.SOLUTION: A floor sound insulation structure 1 comprises: a plurality of sound insulation supporting bodies 50 respectively arranged on an upper face side of a floor structural plywood 10 and elastically supporting a floor material 20; a dynamic vibration absorber 60 disposed between the plurality of sound insulation supporting bodies 50, attached to a lower face of the floor material 20, and comprising a mass 61 and a sheet-like elastic supporting members 62, 63 elastically supporting the mass 61; and an elastic contact member 70 which is disposed between the mass 61 and the lower face of the floor material 20, which is attached to one of the mass 61 and the floor material 20, which is disposed on the other of the mass 61 and the floor material 20 in a non-contact manner and which is in contact with the other of the mass 61 and the floor material 20 in a compressed state in accordance with vibration of the mass 61.SELECTED DRAWING: Figure 2

Inventors:
KAIDA YUJI
ASAI SHINSUKE
KACHI TAKAHIRO
Application Number:
JP2019096528A
Publication Date:
November 26, 2020
Filing Date:
May 23, 2019
Export Citation:
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Assignee:
SUMITOMO RIKO CO LTD
International Classes:
E04F15/20; E04B1/82; E04F15/18
Domestic Patent References:
JP2015148095A2015-08-20
JP2009197556A2009-09-03
JP2000038780A2000-02-08
JP2011099301A2011-05-19
JP2010275847A2010-12-09
JPH11270176A1999-10-05
JP2008014074A2008-01-24
JP2010163804A2010-07-29
JP2006169959A2006-06-29
Foreign References:
US20190178330A12019-06-13
Attorney, Agent or Firm:
Patent business corporation Kyoritsu