Title:
ADHESIVE COMPOSITION FOR FIXING MOVABLE PART, OPTICAL COMPONENT, ELECTRONIC COMPONENT, AND ELECTRONIC MODULE
Document Type and Number:
Japanese Patent JP2020200451
Kind Code:
A
Abstract:
To provide an adhesive composition for fixing a movable part that has excellent adhesiveness during photocuring, thermosetting properties at low temperature, and low curing shrinkage properties, and provide an optical component, an electronic component, and an electronic module using the adhesive composition for fixing the movable part.SOLUTION: An adhesive composition for fixing a movable part, contains a curable resin, a photopolymerization initiator, and a thermosetting agent, wherein the curable resin contains a radical polymerizable compound not having an epoxy group, an epoxy compound not having a radical polymerizable group, and a compound having an epoxy group and a radical polymerizable group, and the thermosetting agent includes one that has a start region temperature the lowest value of which is 80°C or lower.SELECTED DRAWING: None
Inventors:
HAYASHI HIDEYUKI
KAWADA SHINJI
KAWADA SHINJI
Application Number:
JP2020093281A
Publication Date:
December 17, 2020
Filing Date:
May 28, 2020
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C09J4/06; C08G59/17; C09C1/28; C09J11/04; C09J11/06; C09J163/00
Attorney, Agent or Firm:
Atomi International Patent Office