Title:
SUBSTRATE HEAT TREATMENT APPARATUS, SUBSTRATE HEAT TREATMENT METHOD, AND STORAGE MEDIUM
Document Type and Number:
Japanese Patent JP2021012899
Kind Code:
A
Abstract:
To provide a substrate heat treatment apparatus effective for compatibility between film thickness uniformity of a coating to be thermally treated and reliability of recovery of a sublimate produced by heat treatment.SOLUTION: A substrate heat treatment apparatus comprises: a heating part 20 that supports and heats a substrate W formed with a coating; a chamber 30 that separates a treatment space 34 and an external space 35 on the heating part; an outer peripheral exhaust part 40 that is opened within the treatment space on the outside with respect to a peripheral edge of the substrate and that discharges gas within the treatment space; and an exhaust control part 112 that increases the quantity of the gas discharged by the outer peripheral exhaust part, in accordance with the lapse of time for heating the substrate by the heating part.SELECTED DRAWING: Figure 2
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Inventors:
OTSUKA YUKINOBU
Application Number:
JP2019124575A
Publication Date:
February 04, 2021
Filing Date:
July 03, 2019
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/027
Domestic Patent References:
| JPH10223515A | 1998-08-21 | |||
| JP2016039369A | 2016-03-22 | |||
| JP2002110535A | 2002-04-12 | |||
| JP2008300876A | 2008-12-11 | |||
| JP2015015370A | 2015-01-22 | |||
| JP2016115919A | 2016-06-23 | |||
| JP2010034574A | 2010-02-12 | |||
| JP2006059844A | 2006-03-02 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Junji Kashiwaoka
Shigeki Matsuo
Yoshiki Kuroki
Junji Kashiwaoka
Shigeki Matsuo