Title:
RESIN SEALING DEVICE
Document Type and Number:
Japanese Patent JP2021012992
Kind Code:
A
Abstract:
To provide a resin sealing device that can suppress occurrence of molding defects such as voids, bubbles, and wire flow when a multi-layered molded product having a space between a plurality of electronic components such as laminated lead frames and substrates is resin-sealed.SOLUTION: A resin sealing device that clamps a multi-layer molded product 3 having a structure having a space 33 between a substrate 31 and a lead frame 30 as a plurality of laminated electronic components by an upper mold 1 and a lower mold 2, and injects a resin 5 into a cavity 4 formed when the upper mold 1 and the lower mold 2 are mold closed to perform resin sealing molding includes an upper gate 6A and a lower gate 6B that respectively open toward a space 33 between the laminated lead frame 30 and the substrate 31 and a space 40 between the upper mold 1 and the substrate 31 which is an outermost electronic component from among the plurality of electronic components.SELECTED DRAWING: Figure 4
Inventors:
ISHII MASAAKI
Application Number:
JP2019127643A
Publication Date:
February 04, 2021
Filing Date:
July 09, 2019
Export Citation:
Assignee:
ASAHI ENGINEERING
International Classes:
H01L21/56; B29C45/02; B29C45/27
Domestic Patent References:
| JP2009123953A | 2009-06-04 | |||
| JPH0976282A | 1997-03-25 | |||
| JPH0936155A | 1997-02-07 | |||
| JPH11320600A | 1999-11-24 |
Attorney, Agent or Firm:
Hisashi Kato
Keita Tohsaka
Toru Minase
Keita Tohsaka
Toru Minase