Title:
SUBSTRATE LEVITATION TYPE LASER PROCESSING DEVICE AND LEVITATION AMOUNT MEASUREMENT METHOD
Document Type and Number:
Japanese Patent JP2021015931
Kind Code:
A
Abstract:
To provide a substrate levitation type laser processing device and a levitation amount measurement method that can improve the performance of laser processing.SOLUTION: A substrate levitation type laser processing device 1 according to an embodiment includes a stage 10 that levitates and transports a substrate 50 and a levitation amount measurement device 30 that measures the levitation amount H of the substrate 50. Here, a distance between the levitation amount measurement device 30 and the substrate 50 can be automatically adjusted according to the measured levitation amount H. The levitation amount H of the substrate 50 is measured by irradiating the substrate 50 and the stage 10 with a laser beam. The distance between the levitation amount measurement device 30 and the substrate 50 is adjusted by using a feedback mechanism for inputting the measured levitation amount of the substrate 50.SELECTED DRAWING: Figure 1
Inventors:
HAYASHI DAISUKE
MIKAMI TAKAHIRO
SUZUKI YUKI
MIKAMI TAKAHIRO
SUZUKI YUKI
Application Number:
JP2019130992A
Publication Date:
February 12, 2021
Filing Date:
July 16, 2019
Export Citation:
Assignee:
JAPAN STEEL WORKS LTD
International Classes:
H01L21/677; B65G49/05; H01L21/20; H01L21/268
Domestic Patent References:
| JP2016035960A | 2016-03-17 | |||
| JP2014014840A | 2014-01-30 | |||
| JP2017089894A | 2017-05-25 | |||
| JP2006170640A | 2006-06-29 | |||
| JP2009220142A | 2009-10-01 | |||
| JP2011237243A | 2011-11-24 |
Attorney, Agent or Firm:
Ken Ieiri