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Title:
CURABLE COMPOSITION
Document Type and Number:
Japanese Patent JP2021024958
Kind Code:
A
Abstract:
To provide a curable composition in which reduction of stretching of a cured product that could be progressed by a curing and aging process is suppressed, and a cured product obtained by curing the composition.SOLUTION: A multi-liquid type curable composition contains: an agent A containing polyoxyalkylene-based polymer (A) having reactive silicon group shown in a general formula (1), (meth)acrylic acid ester-based polymer (B) having reactive silicon group shown in the general formula (1), and epoxy resin curing agent (D); and an agent B containing epoxy resin (C) and silanol condensation catalyst (F), in which either one or both agent A and agent B contain unsubstituted phenol and a phenolic compound (E) selected from the group consisting of substituted phenol having one or two substituent groups on a benzene ring. -SiR5cX3-c (1) (in the formula, R5 denotes a substituted or unsubstituted hydrocarbon group having a carbon number of 1 to 20. X denotes a hydroxyl group or a hydrolyzable group. c denotes 0 or 1).SELECTED DRAWING: None

Inventors:
MIYAFUJI KIYOSHI
Application Number:
JP2019144297A
Publication Date:
February 22, 2021
Filing Date:
August 06, 2019
Export Citation:
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Assignee:
KANEKA CORP
International Classes:
C08L71/02; C08F8/42; C08F30/08; C08G59/68; C08G65/336; C08K3/36; C08L43/04; C08L63/00; C09J11/06; C09J133/04; C09J163/00; C09J171/02
Domestic Patent References:
JPH02145674A1990-06-05
JPH02228365A1990-09-11
JPH02140269A1990-05-29
JPH02145675A1990-06-05
Foreign References:
WO2019069866A12019-04-11
Attorney, Agent or Firm:
Patent business corporation Yuko patent office



 
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