Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
(METH)ACRYLIC RESIN COMPOSITION, RESIN MOLDING, ILLUMINATION LAMP COVER, AND ILLUMINATION SIGNBOARD
Document Type and Number:
Japanese Patent JP2021036057
Kind Code:
A
Abstract:
To provide a (meth)acrylic resin composition having moderate light diffusivity and high flame retardancy, and to provide a resin molding obtained by molding the (meth)acrylic resin composition.SOLUTION: The (meth)acrylic resin composition contains a (meth)acrylic polymer (P), a phosphorus-based flame retardant (C), and resin particles (F). The resin particles (F) have a dispersed particle diameter of 0.5 μm or more and 10 μm or less. The (meth)acrylic polymer (P) contains: a repeating unit derived from a methacrylate ester (M1) having an aromatic hydrocarbon group or a C3-20 alicyclic hydrocarbon group in a side chain; and a repeating unit derived from an acrylate ester (M2) having an aromatic hydrocarbon group or a C3-20 alicyclic hydrocarbon group in a side chain.SELECTED DRAWING: None

Inventors:
SATO ARIYOSHI
WATANABE HIROYUKI
Application Number:
JP2020201299A
Publication Date:
March 04, 2021
Filing Date:
December 03, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI CHEM CORP
International Classes:
C08L33/10; C08F220/20; C08K5/521; C08L25/04
Domestic Patent References:
JP2011046835A2011-03-10
JP2012161966A2012-08-30
JP2008096781A2008-04-24
Foreign References:
WO2016063898A12016-04-28
Attorney, Agent or Firm:
Field Saki Satoshi
Shunsuke Fushimi
Kazunori Onami