Title:
FLUX AND SOLDER PASTE
Document Type and Number:
Japanese Patent JP2021041463
Kind Code:
A
Abstract:
To provide a flux and a solder paste which can improve a thickening suppression effect.SOLUTION: The solder paste is a flux containing a metal deactivator, in which the metal deactivator contains a hydrazide-based nitrogen compound. A content of the hydrazide-based nitrogen compound is more than 0-10% with respect to the whole flux, and the flux contains one or more resins selected from the group consisting of a rosin-based resin and an acrylic resin.SELECTED DRAWING: None
Inventors:
KITAZAWA KAZUYA
HASHIMOTO YUTAKA
TSUDA RYUICHI
SHIRATORI MASATO
TAKAGI YOSHINORI
KAWASAKI HIROYOSHI
HASHIMOTO YUTAKA
TSUDA RYUICHI
SHIRATORI MASATO
TAKAGI YOSHINORI
KAWASAKI HIROYOSHI
Application Number:
JP2020196787A
Publication Date:
March 18, 2021
Filing Date:
November 27, 2020
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO
International Classes:
B23K35/363; B23K35/22; B23K35/26; C22C13/00; C22C13/02
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Tetsuo Tsuchiya
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Tetsuo Tsuchiya