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Title:
EMITTER SUPPORT STRUCTURE AND FIELD EMISSION DEVICE
Document Type and Number:
Japanese Patent JP2021048051
Kind Code:
A
Abstract:
To avoid joining an excess brazing material and a guard electrode during a vacuum brazing process of a field emission device.SOLUTION: In an emitter support structure 1, an emitter support portion 32 is movably arranged in the directions of both ends of a vacuum chamber 20 of a field emission device, and supports an emitter 31 of the field emission device, a protrusion 51 into which the emitter 31 is inserted is provided at one end of the emitter support portion 32 facing a target 41 of the field emission device. A notch 53 is formed in a peripheral wall portion 52 of the protrusion 51 in the height direction of the peripheral wall portion 52, and an excess brazing material escape groove 54 is formed along the peripheral wall portion 52 on the outside of the protrusion 51.SELECTED DRAWING: Figure 1

Inventors:
OCHI HAYATO
TAKAHASHI RENA
Application Number:
JP2019169936A
Publication Date:
March 25, 2021
Filing Date:
September 19, 2019
Export Citation:
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Assignee:
MEIDENSHA ELECTRIC MFG CO LTD
International Classes:
H01J35/06; H01J1/304; H01J9/02; H01J35/16
Domestic Patent References:
JP6135827B22017-05-31
JP2005074472A2005-03-24
Attorney, Agent or Firm:
Hiromichi Kobayashi
Tomioka Kiyoshi
Uzawa Hidehisa
Tomoyuki Ota