Title:
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR MULTILAYER CERAMIC ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2021052132
Kind Code:
A
Abstract:
To provide a multilayer ceramic electronic component capable of suppressing poor connection between internal electrodes and external electrodes while suppressing poor insulation, and provide a method for manufacturing the same.SOLUTION: The multilayer ceramic electronic component includes a ceramic main body and an external electrode. The ceramic main body includes: a first end surface and a second end surface respectively facing in a first direction; a functional part in which first internal electrodes and second internal electrodes are mutually laminated in a second direction perpendicular to the first direction with ceramic layers interposed therebetween; end margin parts provided respectively between the first end surface and the second internal electrodes and between the second end surface and the first internal electrodes; and side margin parts that respectively cover the functional part from a third direction perpendicular to the first and second directions. The end margin parts contain boron. The side margin parts contain silicon and boron, and a concentration of the boron contained in the side margin parts is less than that of the boron contained in the end margin parts.SELECTED DRAWING: Figure 9
Inventors:
TERAOKA HIDEYA
IMAI ATSUSHI
IMAI ATSUSHI
Application Number:
JP2019175235A
Publication Date:
April 01, 2021
Filing Date:
September 26, 2019
Export Citation:
Assignee:
TAIYO YUDEN KK
International Classes:
H01G4/30
Attorney, Agent or Firm:
Junichi Omori
Chiba Ayako
Chiba Ayako