Title:
TRANSFER DEVICE AND TRANSFER METHOD
Document Type and Number:
Japanese Patent JP2021061394
Kind Code:
A
Abstract:
To provide a transfer device and a transfer method, capable of improving the precision level of transfer process by dropping a chip in a correct position, and also capable of separately driving a stage supporting a substrate to be transferred and a stage supporting a transfer substrate, respectively, thereby achieving a reduction in process time.SOLUTION: A transfer device for transferring a chip given to a transfer substrate onto a substrate to be transferred includes: a first stage capable of supporting the substrate to be transferred; a second stage capable of supporting the transfer substrate so as to face and separate from the substrate to be transferred; a laser irradiation part arranged such that at least a part thereof is apart from the second stage in a direction where the transfer substrate and the substrate to be transferred face each other so that the transfer substrate can be irradiated with a laser beam; and a move part supporting the laser irradiation part and capable of moving the laser irradiation part in the state of emitting a laser beam.SELECTED DRAWING: Figure 1
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Inventors:
KIM MOOIL
BAEK SUNG HWAN
KIM HO AM
KIM HYUN JUN
BAEK SUNG HWAN
KIM HO AM
KIM HYUN JUN
Application Number:
JP2020159713A
Publication Date:
April 15, 2021
Filing Date:
September 24, 2020
Export Citation:
Assignee:
AP SYSTEMS INC
International Classes:
H01L21/67; B23K26/02; B23K26/066; B23K26/08; G09F9/00; H01L21/677; H01L33/62
Attorney, Agent or Firm:
Maeda patent office