Title:
CHIP TRANSFER METHOD AND CHIP TRANSFER APPARATUS
Document Type and Number:
Japanese Patent JP2021061396
Kind Code:
A
Abstract:
To provide a chip transfer method and a chip transfer apparatus capable of transferring a plurality of chips to a predetermined position on a board to be transferred using a mask on which a pattern is formed.SOLUTION: A chip transfer method includes a procedure for installing a transfer board with a plurality of chips on a board to be transferred, a procedure for emitting a line beam, a procedure for shaping a plurality of pattern beams from the line beam using a mask provided in the path of the line beam, a procedure for irradiating the transfer board with the pattern beam to separate the plurality of chips from the transfer board, and a procedure for placing the plurality of chips separated from the transfer board on the board to be transferred, and a chip transfer apparatus for which the chip transfer method is applied.SELECTED DRAWING: Figure 8
Inventors:
BAEK SUNG HWAN
KIM MOOIL
KIM HO AM
KIM HYUN JUN
KIM MOOIL
KIM HO AM
KIM HYUN JUN
Application Number:
JP2020160468A
Publication Date:
April 15, 2021
Filing Date:
September 25, 2020
Export Citation:
Assignee:
AP SYSTEMS INC
International Classes:
H01L21/67; G09F9/00; G09F9/33; H01L21/683; H01L33/48; H05K13/04
Attorney, Agent or Firm:
Maeda patent office