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Title:
PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE PRODUCT
Document Type and Number:
Japanese Patent JP2021080351
Kind Code:
A
Abstract:
To provide a pressure-sensitive adhesive composition that can form a pressure-sensitive adhesive layer having high wettability and high adhesive strength.SOLUTION: The pressure-sensitive adhesive composition includes an ABA-type gradient copolymer having a segment A and a segment B. The segment A has a structural unit derived from a monomer X of which the homopolymer has a glass transition point of 50°C or higher, and a structural unit derived from a monomer Y of which the homopolymer has a glass transition point of 10°C or lower. The segment B has a structural unit derived from a monomer Z of which the homopolymer has a glass transition point of 10°C or lower, and has a glass transition point of 10°C or lower. In the segment A, a content of the structural unit derived from the monomer X continuously decreases in the direction from the segment A to the segment B, and a content of the structural unit derived from the monomer Y continuously increases in the direction from the segment A to the segment B.SELECTED DRAWING: None

Inventors:
NAKAMURA KENICHI
TAKEYA NOBUYUKI
ANDO SATOKO
TOKITA EMIKO
Application Number:
JP2019208141A
Publication Date:
May 27, 2021
Filing Date:
November 18, 2019
Export Citation:
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Assignee:
TOAGOSEI CO LTD
International Classes:
C09J201/00; A41D27/06; C09J7/30; C09J7/38; C09J125/08; C09J133/00; C09J133/08; C09J133/10; C09J133/14
Domestic Patent References:
JP2010265477A2010-11-25
JP2015206858A2015-11-19
JP2014208762A2014-11-06
JP2006506505A2006-02-23
JP2017119758A2017-07-06
Foreign References:
WO2017179479A12017-10-19
WO2018151034A12018-08-23
Attorney, Agent or Firm:
Tsuyoshi Yamada
Kyoko Hino