Title:
MOLDING SYSTEM
Document Type and Number:
Japanese Patent JP2021091195
Kind Code:
A
Abstract:
To provide a molding system capable of reducing molding defects.SOLUTION: There is provided a molding system, in which a first parison forming apparatus 10 comprises a first extruder 13, a first accumulator 14, and a first injection head 16; a second parison forming apparatus 20 comprises a second extruder 23, a second accumulator 24, and a second injection head 26; a first parison 11 and a second parison 21 are injected between first and second molds 31, 41; and based on historical data from past cycles, a control unit 62 is configured to determine a timing of at least one operation start of the first and second parison forming devices 10 and 20 and the first and second molds 31 and 41 in a next cycle.SELECTED DRAWING: Figure 1
Inventors:
HARASAWA YUKI
KATO TAKESHI
OUCHI TSUTOMU
FUKUDA TATSUYA
KATO TAKESHI
OUCHI TSUTOMU
FUKUDA TATSUYA
Application Number:
JP2019224778A
Publication Date:
June 17, 2021
Filing Date:
December 12, 2019
Export Citation:
Assignee:
KYORAKU CO LTD
International Classes:
B29C49/78; B29C49/04; B29C49/42; B29C51/02; B29C51/26; B29C51/46
Domestic Patent References:
| JP2019042991A | 2019-03-22 | |||
| JPH06315756A | 1994-11-15 | |||
| JPH0659746A | 1994-03-04 |
Attorney, Agent or Firm:
sk patent corporation
Akihiko Okuno
Hiroyuki Ito
Akihiko Okuno
Hiroyuki Ito