Title:
END MATERIAL PARTING DEVICE AND END MATERIAL PARTING METHOD
Document Type and Number:
Japanese Patent JP2021098292
Kind Code:
A
Abstract:
To provide an end material parting device parting the end material of a substrate at high precision using a simple constitution.SOLUTION: An end material parting device 1 parts a product P1 of a mother substrate M from an end material Ma, and comprises first to third chuck apparatuses 5A to 5C, a suction hand 9 and a controller 31. The first to third chuck apparatuses 5A to 5C can grasp the end material Ma of the mother substrate M and are mutually independently operable. The suction hand 9 can suck and carry the mother substrate M. The controller 31 performs a step where the mother substrate M is carried by the suction hand 9, thus the end material Ma of the mother substrate M is arranged at a grasping position of the first chuck apparatus 5A, a step where the end material Ma of the mother substrate M is grasped by the first chuck apparatus 5A, and a step where, in a state in which the mother substrate M is grasped by the first chuck apparatus 5A, the suction hand 9 is moved to part the product P1 of the mother substrate M from the end material Ma.SELECTED DRAWING: Figure 4
Inventors:
NAKATA KATSUYOSHI
Application Number:
JP2019230816A
Publication Date:
July 01, 2021
Filing Date:
December 20, 2019
Export Citation:
Assignee:
MITSUBOSHI DIAMOND IND CO LTD
International Classes:
B28D5/00; B26F3/00; B28D7/04; C03B33/03
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation