Title:
FIBROUS MATERIAL, SEALING PART, ELECTRONIC COMPONENT, PACKAGE, PRINTED CIRCUIT BOARD, CLOTH MATERIAL, METHOD FOR PRODUCING FIBROUS MATERIAL, AND MIXTURE MEMBER
Document Type and Number:
Japanese Patent JP2021105239
Kind Code:
A
Abstract:
To provide a fibrous material capable of achieving high thermal conductivity as compared with the conventional art.SOLUTION: A fibrous material 210 includes a resin, and a first material that is included in the resin and contains carbon, boron, nitrogen or silicon, or a ceramic material. There is also provided a method for producing a fibrous material that includes the steps of: mixing a powder of silicon nitride, aluminum nitride, boron, silicon carbide, aluminum, alumina or silica in a resin; extruding a mixture of silicon nitride, aluminum nitride, boron, silicon carbide, aluminum, alumina or silica and the resin by means of an extruder to thereby form a fibrous material; and cutting the fibrous material.SELECTED DRAWING: Figure 12
More Like This:
| JP2009038095 | HIGH FREQUENCY MODULE |
| WO/2022/114280 | SEMICONDUCTOR PACKAGE |
Inventors:
SASAKI BEJI
Application Number:
JP2020173029A
Publication Date:
July 26, 2021
Filing Date:
October 14, 2020
Export Citation:
Assignee:
SASAKI BEJI
International Classes:
H01L23/00; D01F1/10; H01L23/29; H01L23/31; H05K1/03
Attorney, Agent or Firm:
Seiji Ohno
Hiroyuki Ohno
Hiroyuki Ohno