Title:
SEMICONDUCTOR WAFER CLEANING DEVICE AND SEMICONDUCTOR WAFER CLEANING METHOD
Document Type and Number:
Japanese Patent JP2021111703
Kind Code:
A
Abstract:
To propose a semiconductor wafer cleaning device and a cleaning method capable of suppressing the adhesion of a cleaning liquid mist to the surface of a semiconductor wafer during cleaning of the semiconductor wafer.SOLUTION: In a semiconductor wafer cleaning device 1 according to the present invention, a spin cup 20 includes an annular side wall portion 21, an inclined portion 22 in which a lower end portion 22d is connected to an upper end portion 21c of a side wall portion 21, and which is inclined toward a rotary table 13 in the vertical direction, and an annular return portion 23 in which an upper end portion 23c is connected to an upper end portion 22c of the inclined portion 22. A height position h21 of the upper end portion 21c of the side wall portion 21 is arranged at a position lower than a height position h14a of an upper end portion 14a of a wafer holding portion 14, and an angle θ22 of the inclined portion 22 with respect to the horizontal plane and a width w of the inclined portion 22 are configured to satisfy the following equation (A). θ22≥-0.65×w+72.9° (A).SELECTED DRAWING: Figure 1
Inventors:
NODA KAITO
OKUBO TOMOHIRO
NAKAO YUKI
TOMITA MICHIHIKO
OKUBO TOMOHIRO
NAKAO YUKI
TOMITA MICHIHIKO
Application Number:
JP2020003047A
Publication Date:
August 02, 2021
Filing Date:
January 10, 2020
Export Citation:
Assignee:
SUMCO CORP
International Classes:
H01L21/304
Domestic Patent References:
| JP2014086639A | 2014-05-12 | |||
| JP2014086638A | 2014-05-12 | |||
| JP2010010421A | 2010-01-14 | |||
| JPH09148231A | 1997-06-06 |
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Keisuke Kawahara
Mitsutsugu Sugimura
Keisuke Kawahara