Title:
HOT-MELT ADHESIVES WITH IMPROVED ADHESION AND COHESION
Document Type and Number:
Japanese Patent JP2021116422
Kind Code:
A
Abstract:
To provide adhesive hot-melt formulations comprising hot-melt adhesives that have both of very high adhesiveness and very high cohesion.SOLUTION: Novel adhesive hot-melt formulations comprise, as their main component, an isotactic metallocene butene-1 polymer composition, which has a low viscosity and has a bimodal composition, directly obtained during polymerization, in two consecutive and separate reaction steps. Moreover, the adhesive hot-melt formulations comprise less than 5 mass% of at least one viscosity modifier that is not solid at room temperature.SELECTED DRAWING: None
Inventors:
ITALO CORZANI
ALBERTO BUGANA
BIAGIO SAVARE
ALBERTO BUGANA
BIAGIO SAVARE
Application Number:
JP2021005904A
Publication Date:
August 10, 2021
Filing Date:
January 18, 2021
Export Citation:
Assignee:
SAVARE I C SRL
International Classes:
C09J123/20; A61F13/15; A61F13/49; B32B5/24; B32B7/12; B32B27/32; C08F210/08; C09J11/06; C09J11/08
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Toshio Fukui
Mitsutsugu Sugimura
Toshio Fukui