Title:
POLYAMIDE-IMIDE FILM AND PREPARATION METHOD THEREOF
Document Type and Number:
Japanese Patent JP2021119214
Kind Code:
A
Abstract:
To provide a polyamide-imide film that secures excellent tensile toughness and elastic restoring force, and a method for preparing the same.SOLUTION: The polyamide-imide film comprises a polyamide-imide polymer formed by polymerizing a diamine compound, a dianhydride compound and a dicarbonyl compound, where the area value up to the yield point derived by the 0.2% off-set method on a stress-strain curve of the polyamide-imide film measured using a universal testing machine (UTM) is 80 to 150 J/m2.SELECTED DRAWING: Figure 1
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Inventors:
JEONG DAWOO
KIM SUNHWAN
OH DAE SEONG
LEE JIN WOO
LIM DONG JIN
KIM SUNHWAN
OH DAE SEONG
LEE JIN WOO
LIM DONG JIN
Application Number:
JP2021034266A
Publication Date:
August 12, 2021
Filing Date:
March 04, 2021
Export Citation:
Assignee:
SKC CO LTD
International Classes:
C08J5/18; C08G73/14
Domestic Patent References:
| JPH09227697A | 1997-09-02 | |||
| JPS59204518A | 1984-11-19 |
Foreign References:
| WO2017179877A1 | 2017-10-19 | |||
| KR101729731B1 | 2017-04-25 | |||
| US20170130004A1 | 2017-05-11 | |||
| US20130203937A1 | 2013-08-08 | |||
| US20150152226A1 | 2015-06-04 | |||
| EP0125599A2 | 1984-11-21 | |||
| KR20160079549A | 2016-07-06 |
Attorney, Agent or Firm:
Norihito Yamao
Haruhiko Ema
Haruhiko Ema