Title:
SHEET MOLDING COMPOUND USING EPOXY RESIN AND MOLDED ARTICLE THEREOF
Document Type and Number:
Japanese Patent JP2021130791
Kind Code:
A
Abstract:
To provide a sheet molding compound using an epoxy resin which is excellent in SMC moldability, heat resistance, long-term storage stability and productivity, and to provide a molded article thereof.SOLUTION: The sheet molding compound is obtained by blending an epoxy resin composition containing the following components (A)-(E) with reinforcing fibers: (A) an epoxy resin; (B) a curing agent; (C) a polyisocyanate compound; (D) a silicone oil compound; and (E) a surfactant. The sheet molding compound satisfies the following (i). (i) One or both of the following 1 and 2 are satisfied: 1 a glass transition temperature is 120°C or higher when the epoxy resin composition is cured; and 2 the component (E) has a pH value measured by a pH meter of 4.0 or more and 8.0 or less.SELECTED DRAWING: None
Inventors:
OUCHIYAMA NAOYA
SATO TOMOASA
MATSUMOTO MASARU
KAWASHIMA SHIGERU
SATO TOMOASA
MATSUMOTO MASARU
KAWASHIMA SHIGERU
Application Number:
JP2020027996A
Publication Date:
September 09, 2021
Filing Date:
February 21, 2020
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C08J5/24; C08G18/72; C08G59/18; C08L63/00
Attorney, Agent or Firm:
Toshimitsu Ban
Koichi Hosoda
Koichi Hosoda