Title:
UNDERFILL MATERIAL, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP2021134219
Kind Code:
A
Abstract:
To provide an underfill material suppressing voids in a heating and pressurized atmosphere, and capable of obtaining excellent reliability, and to provide a manufacturing method of a semiconductor using the underfill material.SOLUTION: An underfill material comprises a binder resin, a liquid epoxy resin, a hardening agent and a filler. A weight average molecular weight of the binder resin is 200,000 or more, and a glass-transition temperature of the binder resin is less than 30°C. A melting viscosity at a temperature rising rate of 10°C/min in a range of 150-170°C is less than 150 Pa s, a melting viscosity at 250°C is 500,000 Pa s or more, and a reaction rate after heating at 250°C for 60 seconds is less than 30%.SELECTED DRAWING: Figure 1
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Inventors:
MORI DAICHI
KUBOTA TAKAKO
KUBOTA TAKAKO
Application Number:
JP2020028422A
Publication Date:
September 13, 2021
Filing Date:
February 21, 2020
Export Citation:
Assignee:
DEXERIALS CORP
International Classes:
C08L63/00; C08G59/00; C08L61/10; H01L21/60; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Nobuhiro Noguchi
Satoshi Hoyano
Satoshi Hoyano