Title:
SOLDER COMPOSITION AND ELECTRONIC SUBSTRATE
Document Type and Number:
Japanese Patent JP2021154389
Kind Code:
A
Abstract:
To provide a solder composition which can sufficiently suppress voids.SOLUTION: A solder composition contains a flux composition containing (A) a rosin-based resin, (B) an activator and (C) a solvent, and (D) solder powder having a melting point of 200°C or higher and 250°C or lower, in which the component (B) contains (B1) a dicarboxylic acid having a substituted or unsubstituted alkylene group and 3 to 10 carbon atoms, and the component (C) contains (C1) diol or diacetate of diol having a boiling point of 220°C or higher and 250°C or lower.SELECTED DRAWING: None
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Inventors:
EIZAI HIROSHI
Application Number:
JP2021050479A
Publication Date:
October 07, 2021
Filing Date:
March 24, 2021
Export Citation:
Assignee:
TAMURA SEISAKUSHO KK
International Classes:
B23K35/363
Domestic Patent References:
| JP2017035731A | 2017-02-16 | |||
| JP2014100737A | 2014-06-05 | |||
| JP2020040120A | 2020-03-19 | |||
| JP2017185542A | 2017-10-12 |
Foreign References:
| WO2011083831A1 | 2011-07-14 |
Attorney, Agent or Firm:
Intellectual Property Office