Title:
THREE-DIMENSIONAL LAMINATION MOLDING DEVICE
Document Type and Number:
Japanese Patent JP2021165024
Kind Code:
A
Abstract:
To provide a three-dimensional lamination molding device in which the constituent elements of the device are reduced, and capable of reducing the number of steps of three-dimensional lamination molding and reducing molding time.SOLUTION: A three-dimensional lamination molding device (1) comprises a table (11) to be fed with a refractory aggregate (S), refractory aggregate feed means (20) feeding the refractory aggregate (S) onto the table (11), extension means (30) leveling the refractory aggregate (S) fed onto the table (11) to form a sand layer (61) with a prescribed thickness and selective scattering means (40) selectively scattering water glass, a surfactant agent and a water-containing aqueous binder liquid (WB) to the specified parts of the sand layer (61), and the extension means (30) comprises heating means.SELECTED DRAWING: Figure 1
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Inventors:
WATANABE HIROYASU
Application Number:
JP2020069605A
Publication Date:
October 14, 2021
Filing Date:
April 08, 2020
Export Citation:
Assignee:
TOYOTA MOTOR CORP
International Classes:
B28B1/30
Attorney, Agent or Firm:
Ken Ieiri