Title:
PHOTOSENSITIVE COMPOSITION, PATTERNED CURED FILM PRODUCTION METHOD, AND PATTERNED CURED FILM
Document Type and Number:
Japanese Patent JP2021167905
Kind Code:
A
Abstract:
To provide: a photosensitive composition capable of forming a cured product patterned well and having a low dielectric constant; a cured product of the photosensitive composition; and a method of producing a cured product using the photosensitive composition.SOLUTION: A photosensitive composition comprises an alkali-soluble resin (A), a photopolymerizable compound (B), and a photoinitiator (C). A polyfunctional compound with 3 or 4 (meth)acryloyl groups is used as the photopolymerizable compound (B). An oxime ester compound with a specific structure is used as the photoinitiator (C).SELECTED DRAWING: None
Inventors:
KATO HIROKI
SOMEYA KAZUYA
HIKITA JIRO
SOMEYA KAZUYA
HIKITA JIRO
Application Number:
JP2020071281A
Publication Date:
October 21, 2021
Filing Date:
April 10, 2020
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
G03F7/031; G03F7/004; G03F7/027; G03F7/20
Domestic Patent References:
| JP2016519675A | 2016-07-07 | |||
| JP2018506532A | 2018-03-08 | |||
| JP2018151490A | 2018-09-27 | |||
| JP2018151489A | 2018-09-27 |
Foreign References:
| US20140255845A1 | 2014-09-11 |
Attorney, Agent or Firm:
Masayuki Masabayashi
Hayashi Ichiyoshi
Hayashi Ichiyoshi