Title:
LAMINATE STRUCTURE OF SEMICONDUCTOR ELEMENT
Document Type and Number:
Japanese Patent JP2022188545
Kind Code:
A
Abstract:
To provide a laminate structure of a semiconductor element capable of more appropriately protecting a peripheral device from scatters that occur when a package part of a pressure-welded semiconductor element is damaged.SOLUTION: A laminate structure of a semiconductor element is provided. The laminate structure of a semiconductor element includes a laminate having a plurality of heat sinks and a plurality of semiconductor elements provided between the plurality of respective heat sinks, a support part for supporting the laminate, and a plurality of covers provided side by side so as to surround the laminate when seen in a lamination direction of the plurality of heat sinks and the plurality of semiconductor elements of the laminate. The plurality of semiconductor elements are pressure-welded semiconductor elements having a package part, and a semiconductor chip provided inside the package part, and in the plurality of covers, a central part in the lamination direction is bent so as to come closer to the laminate than both end parts of the lamination direction.SELECTED DRAWING: Figure 1
Inventors:
YAMAKAWA TOMOYUKI
HANAOKA ISAMU
KASHIWAGI KOHEI
ICHIKURA YUTA
MARUYAMA YUTAKA
TANAKA SHO
HANAOKA ISAMU
KASHIWAGI KOHEI
ICHIKURA YUTA
MARUYAMA YUTAKA
TANAKA SHO
Application Number:
JP2021096664A
Publication Date:
December 21, 2022
Filing Date:
June 09, 2021
Export Citation:
Assignee:
TOSHIBA MITSUBISHI ELEC IND
TOSHIBA ENERGY SYSTEM & SOLUTION CORP
TOSHIBA ENERGY SYSTEM & SOLUTION CORP
International Classes:
H01L25/07; H01L23/02; H01L23/04; H01L23/40; H02M1/00; H02M7/48
Attorney, Agent or Firm:
Hyuga Temple Masahiko
Junichi Kozaki
Hiroshi Ichikawa
Uchida Keito
Junichi Kozaki
Hiroshi Ichikawa
Uchida Keito