Title:
METHOD FOR PEELING RESIN MASK
Document Type and Number:
Japanese Patent JP2023111873
Kind Code:
A
Abstract:
To provide a method for peeling a resin mask which is excellent in resin mask peelability having a thickness of 100 μm or more.SOLUTION: A method for peeling a resin mask includes a step of peeling a resin mask from a substrate having a resin mask using a detergent composition, wherein the thickness of the resin mask is 100 μm or more, the detergent composition is an aqueous detergent containing the following component A, the following component B, the following component C and the following component D, and the content of the component D in the detergent composition is 60 mass% or more. Component A: quaternary ammonium hydroxide, component B: hydroxyl amine, component C: potassium hydroxide, and component D: water.SELECTED DRAWING: None
Inventors:
YAMADA KOHEI
Application Number:
JP2023008303A
Publication Date:
August 10, 2023
Filing Date:
January 23, 2023
Export Citation:
Assignee:
KAO CORP
International Classes:
G03F7/42; H01L21/027
Attorney, Agent or Firm:
Ikeuchi & Partners Patent Attorney Corporation