Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2514250
Kind Code:
B2
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Inventors:
MACHIDA KATSUYUKI
OIKAWA HIDEO
OIKAWA HIDEO
Application Number:
JP13153889A
Publication Date:
July 10, 1996
Filing Date:
May 26, 1989
Export Citation:
Assignee:
NIPPON TELEGRAPH & TELEPHONE
International Classes:
H01L21/3205; H01L21/283; (IPC1-7): H01L21/3205; H01L21/283
Domestic Patent References:
| JP6484634A |
Attorney, Agent or Firm:
Yoshikazu Tani