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Title:
【発明の名称】セラミツク配線基板
Document Type and Number:
Japanese Patent JP2524129
Kind Code:
B2
Inventors:
FUJINAKA JUJI
KUWAMOTO SHIGETOSHI
Application Number:
JP22409586A
Publication Date:
August 14, 1996
Filing Date:
September 22, 1986
Export Citation:
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Assignee:
KYOCERA CORP
International Classes:
H01L23/12; H05K1/09; (IPC1-7): H05K1/09; H01L23/12



 
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