Title:
【発明の名称】半導体装置カ-ド及びカ-ド装置
Document Type and Number:
Japanese Patent JP2552667
Kind Code:
B2
Inventors:
BANJO TOSHINOBU
UEDA TETSUYA
ONODA SHIGEO
UEDA TETSUYA
ONODA SHIGEO
Application Number:
JP7991687A
Publication Date:
November 13, 1996
Filing Date:
March 31, 1987
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B42D15/02; B42D15/10; G06K17/00; G06K19/077; G11C5/00; (IPC1-7): G06K19/077; B42D15/10; G06K17/00
Domestic Patent References:
| JP625363U |
Attorney, Agent or Firm:
Soga Doteru (6 people outside)