【発明の名称】高周波素子用パッケージ

Title:

【発明の名称】高周波素子用パッケージ

Document Type and Number:

Japanese Patent JP2565359

Kind Code:

B2

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Inventors:

TAKEUCHI YUKIHIRO
HASEGAWA MITSUO
MYAGAWA FUMIO
TAKENOCHI TOSHIICHI

Application Number:

JP32579987A

Publication Date:

December 18, 1996

Filing Date:

December 23, 1987

Export Citation:

Assignee:

FUJITSU KK
SHINKO DENKI KOGYO KK

International Classes:

H01L23/12; H01L23/02; H01L23/04; H01P1/00; H01P5/08; (IPC1-7): H01L23/04

Attorney, Agent or Firm:

Munehisa Matsuda

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