Title:
【考案の名称】多層回路基板
Document Type and Number:
Japanese Patent JP2572626
Kind Code:
Y2
Inventors:
Akira Imoto
Application Number:
JP933392U
Publication Date:
May 25, 1998
Filing Date:
February 27, 1992
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L23/12; H05K1/16; H05K3/46; (IPC1-7): H05K3/46; H01L23/12; H05K1/16
Domestic Patent References:
| JP60106190A | ||||
| JP3195084A | ||||
| JP61102073U |