Title:
【考案の名称】積層セラミック電子部品
Document Type and Number:
Japanese Patent JP2583746
Kind Code:
Y2
Inventors:
Kenichi Hoshi
Application Number:
JP1660192U
Publication Date:
October 27, 1998
Filing Date:
February 20, 1992
Export Citation:
Assignee:
TAIYO YUDEN CO.,LTD.
International Classes:
H01F17/00; (IPC1-7): H01F17/00
Domestic Patent References:
| JP62257709A | ||||
| JP1151212A |
Attorney, Agent or Firm:
Maruoka Masahiko