Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2603088
Kind Code:
B2
Inventors:
Sachiko Nakata
Nakajima Moriyoshi
Nakajima Moriyoshi
Application Number:
JP29136987A
Publication Date:
April 23, 1997
Filing Date:
November 17, 1987
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L21/8247; H01L29/78; H01L29/788; H01L29/792; (IPC1-7): H01L21/8247; H01L29/788; H01L29/792
Domestic Patent References:
| JP61294870A | ||||
| JP6010679A | ||||
| JP61255071A |
Attorney, Agent or Firm:
Fukami Hisaro (3 outside)