Title:
【考案の名称】高低温下でのリードフレーム付きICの多数個接触機構
Document Type and Number:
Japanese Patent JP2604076
Kind Code:
Y2
Inventors:
Akio Nakamura
Yuji Kawanishi
Yuji Kawanishi
Application Number:
JP2784493U
Publication Date:
April 10, 2000
Filing Date:
April 28, 1993
Export Citation:
Assignee:
Ando Electric Co., Ltd.
International Classes:
G01R31/26; H01L21/66; (IPC1-7): G01R31/26; H01L21/66
Domestic Patent References:
| JP1253663A | ||||
| JP627192A | ||||
| JP59195740U |