Title:
【発明の名称】低弾性率ポリイミドおよびその製造法
Document Type and Number:
Japanese Patent JP2609140
Kind Code:
B2
Abstract:
A solvent-soluble polyimide having a low elastic modulus comprises from 60 to 99 mol % of repeating units of the formula: (in which Ar is a tetravalent aromatic group; the groups X and Y are each independently a C1-C4 alkyl group, a halogen atom, a carbonyl group or a hydroxyl group; and l and m are each 0, 1, 2 and 3); and from 1 to 40 mol % of repeating units of formula: (in which R<1> is a C3-C5 alkylene group or a phenylene group; R<2> is a C1-C4 alkyl group or a phenyl group; and n is an integer of 20 to 300). The polyimide is produced by reacting an appropriate aromatic diamine, silicone diamine and aromatic tetracarboxylic acid dianhydride in an organic polar solvent at 20 to 250 DEG C.
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Inventors:
This Shiro
Takao Kawamoto
Kazuta Kikuta
Takao Kawamoto
Kazuta Kikuta
Application Number:
JP29436088A
Publication Date:
May 14, 1997
Filing Date:
November 21, 1988
Export Citation:
Assignee:
Chisso Co., Ltd.
International Classes:
C08G73/10; C08G77/455; (IPC1-7): C08G73/10
Domestic Patent References:
| JP59219330A |
Attorney, Agent or Firm:
Katsuhiko Nonaka