Title:
【発明の名称】半導体用パッケージの封止方法
Document Type and Number:
Japanese Patent JP2647194
Kind Code:
B2
Abstract:
This invention relates to a semiconductor device package (1), ccmprising a carrier body (2) which is to be mounted with a semiconductor device (4) and which has an annular adhesion layer formed thereon, a cap (3) which is to be adhered to the carrier body (2) to hermetically seal the carrier body (2), and an adhesive applied between the adhesion layer of the carrier body (2) and the cap (3) and hardened after at least one of the carrier body (2) and the cap (3) is pivoted to be coaxial with the adhesion layer. With this arrangement, voids can be eliminated from the adhesive, and a sealing property of the package can be improved.
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Inventors:
NISHIGUCHI KATSUNORI
Application Number:
JP9681189A
Publication Date:
August 27, 1997
Filing Date:
April 17, 1989
Export Citation:
Assignee:
SUMITOMO DENKI KOGYO KK
International Classes:
H01L23/02; H01L21/00; H01L21/50; H01L23/10; (IPC1-7): H01L23/02
Domestic Patent References:
| JP60223142A | ||||
| JP5932156A | ||||
| JP6129155A |
Attorney, Agent or Firm:
Yoshiki Hasegawa (3 outside)