Title:
【発明の名称】スケイラブル・ヒューズ・リンク素子の形成方法
Document Type and Number:
Japanese Patent JP2653672
Kind Code:
B2
Abstract:
PURPOSE: To obtain a high scalability by forming a mask in a desired fuse link form on a first conductive layer, forming second and third conductive layers on them, and performing a second mask to the third conductive layer part and then dry etching. CONSTITUTION: An insulation mask 36 is formed in the form of a fuse link of desired size on a thin metallization layer 34, a thick metallization layer 38 and a thick conductive layer 40 are formed on the thin metallization layer and a separation mask, and photoresist masks 42 and 44 for determining the form of mutual connection are formed on the surface of a conductive layer. Then, dry etching at an original location is executed on the conductive layer, the thick metallization layer, and the thin metallization layer, mutual connections 46 and 48 where a barrier region consisting of the thick metallization layer is located are formed, and a thin metallization layer part that is not covered with a first mask or the photoresist mask is eliminated during etching of the original location and a fuse link 50 is left, thus minimizing a dry etching disaster and overetching of a sensitive layer on the substrate surface, reducing the number of masking levels, and reducing the line width of a component.
Inventors:
MAIKURU TOOMASU UERUCHI
RONARUDO AARU MATSUKUMAN
MANUERU RUISU TORENO JUNIA
EBARISUTO GARUSHIA JUNIA
RONARUDO AARU MATSUKUMAN
MANUERU RUISU TORENO JUNIA
EBARISUTO GARUSHIA JUNIA
Application Number:
JP13429388A
Publication Date:
September 17, 1997
Filing Date:
May 31, 1988
Export Citation:
Assignee:
TEKISASU INSUTORUMENTSU INC
International Classes:
H01L21/82; H01L27/10; (IPC1-7): H01L21/82; H01L27/10
Domestic Patent References:
| JP59208854A |
Attorney, Agent or Firm:
Akira Asamura (2 outside)