Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2665336
Kind Code:
B2
Inventors:
Kubota Masayuki
Shinsuke Shika
Eiichi Tode
Togawa Toshio
Shinsuke Shika
Eiichi Tode
Togawa Toshio
Application Number:
JP18436187A
Publication Date:
October 22, 1997
Filing Date:
July 22, 1987
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
G11B7/125; G11B7/13; H01S5/00; (IPC1-7): H01S3/18; G11B7/125; G11B7/13
Domestic Patent References:
| JP63178372U |
Attorney, Agent or Firm:
Kenichi Hayase