Title:
【発明の名称】半導体ウエハの検査装置
Document Type and Number:
Japanese Patent JP2672972
Kind Code:
B2
Inventors:
Masahiko Sugiyama
Masahiko Kono
Masahiko Kono
Application Number:
JP11672688A
Publication Date:
November 05, 1997
Filing Date:
May 12, 1988
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
G01R31/26; H01L21/66; H01L21/67; H01L21/68; (IPC1-7): H01L21/66; G01R31/26; H01L21/68
Attorney, Agent or Firm:
Takehiko Suzue (3 outside)