Title:
【発明の名称】半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP2677242
Kind Code:
B2
Abstract:
A lead portion of a film carrier package is sandwiched between a slanted area of a radiation plate and a slanted area of a press frame. The radiation plate has the structures that the front surface thereof has the flat area at the central unit parallel to the back surface, and has at the peripheral portion the slanted area increasing or decreasing the thickness toward the outer periphery of the radiation plate. The film carrier package has the structures that a window is formed at the central area thereof, having a size smaller than the flat area, a slit is formed in an insulating film inside of the interconnection pattern by 1 to 5 mm, and the area surrounded by slits at the four sides is larger than the outer dimension of the radiation plate. The slanted area of the radiation plate engages with the slanted area of the press frame. The film carrier package with the radiation plate can be assembled in a short period while ensuring a low heat resistance.
Inventors:
Akira Haga
Suzuki Katsunobu
Suzuki Katsunobu
Application Number:
JP10375595A
Publication Date:
November 17, 1997
Filing Date:
April 27, 1995
Export Citation:
Assignee:
NEC
International Classes:
H01L21/60; H01L23/24; H01L23/367; H01L23/498; (IPC1-7): H01L21/60
Domestic Patent References:
| JP6163632A | ||||
| JP388345A | ||||
| JP5175265A | ||||
| JP289348A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)