Title:
【発明の名称】ペレットボンディング装置
Document Type and Number:
Japanese Patent JP2683698
Kind Code:
B2
Inventors:
Amagi Hijio
Application Number:
JP16683789A
Publication Date:
December 03, 1997
Filing Date:
June 30, 1989
Export Citation:
Assignee:
Toshiba Mechatronics Co., Ltd.
International Classes:
H01L21/52; (IPC1-7): H01L21/52
Attorney, Agent or Firm:
Shuji Shiokawa