【発明の名称】薄板研磨方法 - Shin-Etsu Semiconductor Co., Ltd.

Title:

【発明の名称】薄板研磨方法

Document Type and Number:

Japanese Patent JP2688584

Kind Code:

B2

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Inventors:

Koichi Tanaka
Uchiyama Yuu
Kimura Yoshiharu

Application Number:

JP1780189A

Publication Date:

December 10, 1997

Filing Date:

January 30, 1989

Export Citation:

Assignee:

Shin-Etsu Semiconductor Co., Ltd.

International Classes:

B24B37/015; B24B37/07; B24B37/10; H01L21/304; (IPC1-7): H01L21/304; B24B37/04

Domestic Patent References:

Attorney, Agent or Firm:

Takahashi Masahisa

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