Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2716524
Kind Code:
B2
Abstract:
PURPOSE:To enable a wire to be strongly joined to an external terminal by providing a projecting part which deeply bites into the inside of a sheathing member on the rear surface of the external terminal for allowing a supersonic energy to be transmitted efficiently to the external terminal. CONSTITUTION:A projecting part 10 projecting toward a projecting piece 6b side of a sheathing member 6 is provided at both edges of the tip part on the rear surface of external terminals 4 and 5 and the tip part of the external terminals 4 and 5 are formed nearly in U shape when viewed from the front. In these external terminals 4 and 5, both projecting parts 10 bite deeply into the inside of a protruding piece 6b, thus enabling the external terminals 4 and 5 to be retained strongly to the sheathing member 6. It prevents the external terminals 4 and 5 from being vibrated when supersonic wire bonding gives vibration to the external terminals 4 and 5, thus enabling the supersonic energy to be transmitted efficiently to the external terminals 4 and 5 and enabling a wire 8 to be jointed strongly to bonding pads 4a and 5a of the external terminals 4 and 5.
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| JP4434623 | Bonding equipment and bonding method |
| JP4860128 | Wire bonding method |
Inventors:
Ariyoshi Shogo
Application Number:
JP12723089A
Publication Date:
February 18, 1998
Filing Date:
May 18, 1989
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L21/607; H01L21/60; H01L23/04; H01L23/28; (IPC1-7): H01L23/04; H01L21/607; H01L23/28
Domestic Patent References:
| JP63186455A | ||||
| JP63107055A | ||||
| JP62217641A | ||||
| JP62154744A | ||||
| JP6327058U | ||||
| JP6242254U |
Attorney, Agent or Firm:
Takada Mamoru