Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2722451
Kind Code:
B2
Inventors:
BANJO TOSHINOBU
SHIMAMOTO HARUO
YAGORA HIDEYA
UEDA TETSUYA
TERAOKA YASUHIRO
SEKI HIROSHI
SHIMAMOTO HARUO
YAGORA HIDEYA
UEDA TETSUYA
TERAOKA YASUHIRO
SEKI HIROSHI
Application Number:
JP9351987A
Publication Date:
March 04, 1998
Filing Date:
April 15, 1987
Export Citation:
Assignee:
MITSUBISHI DENKI KK
International Classes:
H01L23/28; H01L21/60; (IPC1-7): H01L23/28; H01L21/60
Domestic Patent References:
| JP5839037A | ||||
| JP6159848A | ||||
| JP62277753A |
Attorney, Agent or Firm:
Shigeaki Yoshida (2 outside)